The Pixel Detector Research Group was established in 2019. Aligned with major national strategic needs and the international frontiers of science and technology, the Group is structured around two primary thrusts: the development of readout electronics for large-scale scientific facilities and the research, development, and application of advanced application-specific integrated circuit (ASIC) technologies. Its core R&D activities cover silicon pixel detector chips, silicon microstrip detector readout chips, detector front-end electronics, data acquisition (DAQ) systems, and related application platforms.

The Group has provided critical technical support for major national initiatives and missions, including the NSFC Major Scientific Instrument Projects, HIAF-HIRIBL. Through sustained efforts, it has established an end-to-end R&D capability spanning "chips–electronics–systems–algorithms". The Group has built an approximately 300 m² chip packaging and electronics testing facility, equipped with dedicated instruments. It continues to advance the localization of key core technologies, providing reliable technical support for the operation of large-scale scientific facilities and space exploration missions.

Over the past five years, the Group has led and undertaken more than 20 research projects. The Group currently comprises 7 staff members, 3 research support personnel, 15 graduate students from the University of Chinese Academy of Sciences, and 3 jointly supervised graduate students.

Nuclear Electronics and Nuclear Detection Technology

During the past five years, the research group has produced more than 70 SCI-indexed publications, including over 30 Q1 papers, as well as more than 10 papers in Chinese core journals. The group has also been granted over 20 China invention patents and has received 5 awards.